Socket: integrated circuits; DIP22; Pitch: 2.54mm; precision; THT
Socket: integrated circuits; DIP64; Pitch: 2.54mm; precision; THT
Heat transfer pad: mica; SOT93,TOP3; 0.8K/W; L: 25mm; W: 20mm
Heat transfer pad: mica; TO220; 1.2K/W; L: 18mm; W: 13mm; Thk: 0.1mm
Heat transfer pad: mica; TO3; 0.35K/W; L: 41.5mm; W: 28.2mm
Insulating bushing; TO126; 8mm; max.130°C
Insulating bushing; TO220; 6.1mm; max.130°C
Insulating bushing; TO220; 6.2mm; max.130°C
Insulating bushing; TO3,TOP3; 8mm; max.130°C
Socket: integrated circuits; PLCC20; THT; phosphor bronze; tinned
Socket: integrated circuits; PLCC28; THT; phosphor bronze; tinned
Socket: integrated circuits; PLCC28; SMT; phosphor bronze; tinned
Socket: integrated circuits; PLCC32; THT; phosphor bronze; tinned
Socket: integrated circuits; PLCC44; THT; phosphor bronze; tinned
Socket: integrated circuits; PLCC52; THT; phosphor bronze; tinned
Socket: integrated circuits; PLCC52; SMT; phosphor bronze; tinned
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